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AF 163-2 designates a family of thermosetting modified epoxy structural adhesives in film form which are available in a variety of weights with or without a supporting carrier. |
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AF 163-2 films are designed for both solid panel and honeycomb sandwich constructions. |
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These products offer the following advantageous properties. |
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- High bond strengths from -55°C to +121°C (-67°F to +250°F). |
| - High fracture toughness and peel strengths. |
| - Excellent resistance to high moisture environments before and after curing. |
| - Short cure times as low as 107°C (225° F) (90 minutes). |
| - Freedom from volatile by-products during cure which permits low pressure bonding. |
| - Vacuum cure capability. |
| - Bondline heat up rates as low as 0.6°C/minute (1°F/minute) can be tolerated. |
| - X-ray opaque resin system allows use of X-ray NDT methods. |
| - Improved shop open time and long shelf life |
| - Limited self-extinguishing characteristics. |
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| Type |
Description |
| Colour |
Red (yellow, blue, green) |
| Kind of chemistry |
Modified epoxy |
| Peel strength |
25-33 piw (43.8 - 57.8 N/cm) -55°C (-67°F)
29-45 piw (50.8 - 78.8 N/cm) 24°C (75°F)
24-40 piw (42.0 - 70.0 N/cm) 82°C (180°F)
20-30 piw (35.0 - 52.5 N/cm) 121°C (250°F) |
| Overlap shear strength |
5100-6400 psi (35.1 - 44.1 MPa) -55°C (-67°F)
5200-5800 psi (35.8 - 40.0 MPa) 24°C (75°F)
3200-3800 psi (22.0 - 26.2 MPa) 82°C (180°F) |
| Service temperature range |
-55°C to +121°C(-67°F to +250°F) |
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